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  rev. 2.4 page 1 2009-11-10 sipmos ? power transistor ? n channel ? enhancement mode ? avalanche-rated pin 1 pin 2 pin 3 g d s type v ds i d r ds(on ) package pb-free buz 73 a 200 v 5.5 a 0.6 pg-to-220 -3 yes maximum ratings parameter symbol values unit continuous drain current t c = 37 ?c i d 5.5 a pulsed drain current t c = 25 ?c i dpuls 22 avalanche current,limited by t jmax i ar 7 avalanche energy,periodic limited by t jmax e ar 6.5 mj avalanche energy, single pulse i d = 7 a, v dd = 50 v, r gs = 25 l = 3.67 mh, t j = 25 ?c e as 120 gate source voltage v gs 20 v power dissipation t c = 25 ?c p tot 40 w operating temperature t j -55 ... + 150 ?c storage temperature t stg -55 ... + 150 thermal resistance, chip case r thjc 3.1 k/w thermal resistance, chip to ambient r thja 75 din humidity category, din 40 040 e iec climatic category, din iec 68-1 55 / 150 / 56 buz 73a h
buz 73a h rev. 2.4 page 2 2009-11-10 electrical characteristics, at t j = 25c, unless otherwise specified parameter symbol values unit min. typ. max. static characteristics drain- source breakdown voltage v gs = 0 v, i d = 0.25 ma, t j = 25 c v (br)dss 200 - - v gate threshold voltage v gs = v ds, i d = 1 ma v gs(th) 2.1 3 4 zero gate voltage drain current v ds = 200 v, v gs = 0 v, t j = 25 c v ds = 200 v, v gs = 0 v, t j = 125 c i dss - - 10 0.1 100 1 a gate-source leakage current v gs = 20 v, v ds = 0 v i gss - 10 100 na drain-source on-resistance v gs = 10 v, i d = 4.5 a r ds(on) - 0.5 0.6 w
buz 73a h rev. 2.4 page 3 2009-11-10 electrical characteristics, at t j = 25c, unless otherwise specified parameter symbol values unit min. typ. max. dynamic characteristics transconductance v ds 3 2 * i d * r ds(on)max, i d = 4.5 a g fs 3 4.2 - s input capacitance v gs = 0 v, v ds = 25 v, f = 1 mhz c iss - 400 530 pf output capacitance v gs = 0 v, v ds = 25 v, f = 1 mhz c oss - 85 130 reverse transfer capacitance v gs = 0 v, v ds = 25 v, f = 1 mhz c rss - 45 70 turn-on delay time v dd = 30 v, v gs = 10 v, i d = 3 a r gs = 50 w t d(on) - 10 15 ns rise time v dd = 30 v, v gs = 10 v, i d = 3 a r gs = 50 w t r - 40 60 turn-off delay time v dd = 30 v, v gs = 10 v, i d = 3 a r gs = 50 w t d(off) - 55 75 fall time v dd = 30 v, v gs = 10 v, i d = 3 a r gs = 50 w t f - 30 40
buz 73a h rev. 2.4 page 4 2009-11-10 electrical characteristics, at t j = 25c, unless otherwise specified parameter symbol values unit min. typ. max. reverse diode inverse diode continuous forward current t c = 25 c i s - - 5.5 a inverse diode direct current,pulsed t c = 25 c i sm - - 22 inverse diode forward voltage v gs = 0 v, i f = 14 a v sd - 1.3 1.7 v reverse recovery time v r = 100 v, i f = l s, d i f /d t = 100 a/s t rr - 200 - ns reverse recovery charge v r = 100 v, i f = l s, d i f /d t = 100 a/s q rr - 0.6 - c
buz 73a h rev. 2.4 page 5 2009-11-10 drain current i d = | ( t c ) parameter: v gs 3 10 v 0 20 40 60 80 100 120 c 160 t c 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 a 6.0 i d power dissipation p tot = | ( t c ) 0 20 40 60 80 100 120 c 160 t c 0 5 10 15 20 25 30 35 w 45 p tot safe operating area i d = | ( v ds ) parameter: d = 0.01 , t c = 25c -1 10 0 10 1 10 2 10 a i d 10 0 10 1 10 2 v v ds r ds(on) = v ds / i d dc 10 ms 1 ms 100 s t p = 36.0s transient thermal impedance z th jc = | ( t p ) parameter: d = t p / t -3 10 -2 10 -1 10 0 10 1 10 k/w z thjc 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 0 s t p single pulse 0.01 0.02 0.05 0.10 0.20 d = 0.50
buz 73a h rev. 2.4 page 6 2009-11-10 typ. output characteristics i d = |( v ds ) parameter: t p = 80 s 0 2 4 6 8 10 12 v 16 v ds 0 1 2 3 4 5 6 7 8 9 10 11 a 13 i d v gs [v] a a 4.0 b b 4.5 c c 5.0 d d 5.5 e e 6.0 f f 6.5 g g 7.0 h h 7.5 i i 8.0 j j 9.0 k k 10.0 l p tot = 40w l 20.0 typ. drain-source on-resistance r ds (on) = |( i d ) parameter: v gs 0 2 4 6 8 a 11 i d 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 w 1.8 r ds (on) v gs [v] = a 4.0 v gs [v] = a a 4.5 b b 5.0 c c 5.5 d d 6.0 e e 6.5 f f 7.0 g g 7.5 h h 8.0 i i 9.0 j j 10.0 k k 20.0 typ. transfer characteristics i d = f ( v gs ) parameter: t p = 80 s v ds 3 2 x i d x r ds(on)max 0 1 2 3 4 5 6 7 8 v 10 v gs 0 1 2 3 4 5 6 7 8 9 10 11 a 13 i d typ. forward transconductance g fs = f ( i d ) parameter: t p = 80 s, v ds 3 2 x i d x r ds(on)max 0 2 4 6 8 a 12 i d 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 s 6.0 g fs
buz 73a h rev. 2.4 page 7 2009-11-10 gate threshold voltage v gs (th) = | ( t j ) parameter: v gs = v ds , i d = 1 ma 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 v 4.6 v gs(th) -60 -20 20 60 100 c 160 t j 2% typ 98% drain-source on-resistance r ds (on) = | ( t j ) parameter: i d = 4.5 a, v gs = 10 v -60 -20 20 60 100 c 160 t j 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 w 1.9 r ds (on) typ 98% typ. capacitances c = f ( v ds ) parameter: v gs = 0v, f = 1mhz 0 5 10 15 20 25 30 v 40 v ds -2 10 -1 10 0 10 1 10 nf c c rss c oss c iss forward characteristics of reverse diode i f = | ( v sd ) parameter: t j , t p = 80 s -1 10 0 10 1 10 2 10 a i f 0.0 0.4 0.8 1.2 1.6 2.0 2.4 v 3.0 v sd t j = 25 c typ t j = 25 c (98%) t j = 150 c typ t j = 150 c (98%)
buz 73a h rev. 2.4 page 8 2009-11-10 avalanche energy e as = | ( t j ) parameter: i d = 7 a, v dd = 50 v r gs = 25 w , l = 3.67 mh 20 40 60 80 100 120 c 160 t j 0 10 20 30 40 50 60 70 80 90 100 110 mj 130 e as typ. gate charge v gs = | ( q gate ) parameter: i d puls = 14 a 0 4 8 12 16 20 24 28 32 nc 38 q gate 0 2 4 6 8 10 12 v 16 v gs ds max v 0,8 ds max v 0,2 drain-source breakdown voltage v (br)dss = | ( t j ) -60 -20 20 60 100 c 160 t j 180 185 190 195 200 205 210 215 220 225 230 v 240 v (br)dss

published by infineon technologies ag 81726 munich, germany ? 2009 infineon technologies ag all rights reserved. legal disclaimer the information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. with respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, infineon technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. information for further information on technology, delivery terms and conditions and prices, please contact the nearest infineon technologies office (www.infineon.com). warnings due to technical requirements, components may contain dangerous substances. for information on the types in question, please contact the nearest infineon technologies office. infineon technologies components may be used in life-support devices or systems only with the express written approval of infineon technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. if they fail, it is reasonable to assume that the health of the user or other persons may be endangered.


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